Intermolecular to Present Results at ALD 2016 from its High-Throughput Experimentation Platform and State-of-the-Art ALD Technology

SAN JOSE, Calif., July 25, 2016 /PRNewswire/ — Intermolecular, Inc. (NASDAQ: IMI), the trusted partner in materials innovation, today announced it will present at ALD 2016 on Wednesday, July 27, 2016, in Dublin, Ireland. Nobi Fuchigami, Member of Technical Staff at Intermolecular, will review atomic layer deposition (ALD) processes for thin (<5nm) nickel and nickel nitride films using amidinate precursors for high work function electrode layers.  The experiments were performed using Intermolecular’s high-throughput experimentation platform and state-of-the art ALD site-isolated and quad combi ALD reactor technology.

In addition, Karl Littau, Ph.D, Senior Principal Scientist at Intermolecular, will present two posters showcasing the following:

About Intermolecular, Inc.

Intermolecular® is the trusted partner for advanced materials innovation. Advanced materials are at the core of innovation in the 21st century for a wide range of industries including semiconductors, consumer electronics, automotive and aerospace. With its substantial materials expertise; accelerated learning and experimentation platform; and information and analytics infrastructure, Intermolecular has a ten-year track record helping leading companies accelerate and de-risk materials innovation.

“Intermolecular” and the Intermolecular logo are registered trademarks; all rights reserved. Learn more at or follow on Twitter at @IMIMaterials.


Kelly Karr 
Tanis Communications, Inc. 

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SOURCE Intermolecular, Inc.

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