TI enables more efficient motor design with faster, more accurate current-sense amplifier

DALLAS, Nov. 8, 2016 /PRNewswire/ — Texas Instruments (TI) (NASDAQ: TXN) today introduced a new current-sense amplifier for in-line motor phase current measurement that improves overall motor efficiency, compared to existing current-sense amplifiers. The INA240 offers enhanced pulse-width modulation (PWM) rejection for systems running at up to 80 V to support a variety of applications such as motor control, solenoid control and power delivery systems. For more information about the new current-sense amplifier or to order samples, see www.ti.com/INA240-pr.

Key features and benefits

To see the new current-sense amplifier in a live Smart Factory Industry 4.0 demonstration and learn about other ways TI is engineering industrial innovation, visit Booth 219 in Hall A4 at electronica, Nov. 8-11, 2016. The INA240 will also be on display at the SPS IPC Drives exhibition in Booth 6-441 starting Nov. 22.

Tools and support to jump-start design
Short, use-case technical notes called TI TechNotes offer engineers implementation techniques related to low-drift in-line motor current phase measurement and current monitoring for overcurrent protection.

Support is available in the TI E2E™ Community Current Sensing forum, where engineers can search for solutions, get help, share knowledge, and solve problems with fellow engineers and TI experts. As with TI’s entire current-sensing portfolio, designers have access to a full suite of support resources, including a complete library of TI Designs reference designs, evaluation modules (EVMs), online training series and SPICE models.

Package, availability and pricing
The 8-pin INA240 is available now in a 3-mm-by-4.4-mm thin-shrink small outline package (TSSOP) from the TI store and authorized distributors. Pricing is US$0.99 in 1,000-unit quantities. An evaluation module (EVM) is available now in the TI store for US$25.

The INA240 is the latest addition to TI’s growing portfolio of innovative current-sense amplifiers that offers a leading combination of power, efficiency and accuracy. Explore TI’s entire current-sense amplifier portfolio.

Learn more about TI’s current-sense amplifiers portfolio

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog integrated circuits (ICs) and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

BoosterPack, C2000, LaunchPad and TI E2E are trademarks of Texas Instruments. All other trademarks and registered trademarks are the property of their respective owners.

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SOURCE Texas Instruments

BMC's Control-M Delivers Simplified Management for SAP® Workloads

HOUSTON, Nov. 8, 2016 /PRNewswire/ — BMC, the global leader in IT solutions for the digital enterprise, today announced innovations designed to help companies faced with an increasing list of applications and platforms that need to be managed and integrated with their SAP® ecosystem. Control-M, the market-leading application workload automation platform from BMC, now features support for SAP S/4HANA® and SAP Financial Closing cockpit (FCc.) By delivering the key capabilities necessary to drive SAP across the enterprise, BMC’s Control-M for SAP solution automates the SAP workloads at the core of business operations around the world.

“Control-M is at the intersection of infrastructure, data, and applications, and we continue to develop innovations that improve the experience for our Control-M customers,” said Gur Steif, president, Workload Automation at BMC. “These new capabilities ensure that Control-M can support our customers’ SAP environment today and in the future with simplified and automated management.”

“Control-M provides Eaton with outstanding uptime and helps us do business in over 170 countries worldwide,” said Larry E. Hicks, manager, data center services, IT infrastructure, Eaton. “Our major ERP Systems are SAP, Oracle, and MFGPRO. We are very pleased with the Control-M performance and ability to be a single workload automation solution. We would also acknowledge the BMC support for newer technologies such as SAP S/4HANA, Oracle R12, Managed File Transfer, Web Service Client, and Hadoop. We are confident Control-M will be able to support our environment as we move forward.”

By adding support for SAP Financial Closing cockpit, customers can reduce the amount of manual effort and streamline their month-end closing. With the addition of SAP S/4HANA support, the Control-M for SAP solution extends its capability to automate and manage SAP application workloads to the next generation SAP platform. These new features build upon existing support for SAP BusinessObjects™, SAP R/3®, SAP Process Integration, SAP Business Warehouse, and SAP Data Archiving.

With BMC’s Control-M solution, organizations can integrate SAP HANA® workflows with a wide range of applications in the SAP portfolio, like Concur and Fieldglass, through a single point of control. The Control-M solution also allows organizations to schedule and manage SAP services according to business priorities. Slowdowns and failures are detected with predictive analytics and intelligent monitoring of SAP workflows, before service delivery is interrupted.

The new Control-M for SAP features are the latest in a series of enhancements to BMC’s digital enterprise automation solutions. In September 2016, BMC announced new Control-M features including capabilities for more unified, highly-efficient file transfer, optimized rapid cloud deployment for AWS and Azure, and a new Automation API with expanded ‘Jobs-as-Code’ capabilities for DevOps teams.

For more information about BMC’s Control-M for SAP, visit www.bmc.com/control-m-sap

For more information about BMC’s workload automation solutions, visit http://www.bmc.com/it-solutions/workload-automation.html.

About BMC
BMC is a global leader in innovative software solutions that enable businesses to transform into digital enterprises for the ultimate competitive advantage. Our Digital Enterprise Management solutions are designed to make digital business fast, seamless, and optimized from mainframe to mobile to cloud and beyond. BMC digital IT transforms 82 percent of the Fortune 500 and serves more than 10,000 customers worldwide.

BMC – Bring IT to Life
BMC, BMC Software, the BMC logo, and the BMC Software logo are the exclusive properties of BMC Software Inc., are registered or pending registration with the U.S. Patent and Trademark Office, and may be registered or pending registration in other countries. All other BMC trademarks, service marks, and logos may be registered or pending registration in the U.S. or in other countries. All other trademarks or registered trademarks are the property of their respective owners. ©Copyright 2016 BMC Software, Inc.

SAP, SAP S/4HANA, SAP BusinessObjects, SAP R/3, and SAP HANA are trademarks or registered trademarks of SAP SE in Germany and in several other countries.

Editorial contacts:
Sheila Watson
D: 713.918.8832
M: 713.294.6818

Molly Bing
Hotwire PR
D: 212.897.2157

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Earth Observation Analysis Service powered by SAP HANA®

BARCELONA, Spain, Nov. 8, 2016 /PRNewswire/ — SAP SE (NYSE: SAP) today, in cooperation with the European Space Agency (ESA), announced the Earth Observation Analysis service, a cloud service powered by the SAP HANA® platform. The two organizations have been working together since early 2016, facilitating access to a new field of business opportunities in the geospatial context. They have done this by combining the power of SAP HANA with ESA’s accurate, timely, and easily accessible Earth observation data, especially from the Copernicus program. Today at SAP® TechEd Barcelona, reinsurance company Munich Re showcases its use of the Earth Observation Analysis service for gaining insights and predicting potential future impact from historic and current data.

“Every year, wildfires affect nature, people, their homes and businesses,” said Andreas Siebert, Head of Geospatial Solutions, Munich Re. “While the progress of a fire itself is hard to predict, this new service from SAP, leveraging satellite data from ESA, allows us to accurately calculate costs and risks related to wildfires and even gain insights into the future probability of wildfires. This will help us to keep costs down for our clients.”

Powered by SAP HANA, the Earth Observation Analysis service provides a standardized interface for quick, easy consumption of detailed analytics and clusters them according to customer needs. Government agencies and companies active in all industries, from insurance and reinsurance to mill products, mining, utilities, and retail, can leverage the application programming interface (API) delivered through the Earth Observation Analysis service. Based on continuous access to historical and real-time satellite data from around the world, they can make improved business decisions concerning elementary industry-specific questions. Questions may include where to place new power lines, where to build a new store or when to harvest crops. Ultimately, the service helps business users and data scientists reduce the complexity of obtaining reliable insights.

“Our partnership with ESA paves the way to a new field of geospatial business applications, making it possible to close the gap between traditional Earth observation and a digitalized business world,” said Dr. Carsten Linz, Business Development Officer and Global Head, Center for Digital Leadership, SAP. “That opens a bright future for space-related applications, such as digital farming, gas pipeline management, and the improved planning of smart cities – bringing businesses to a competitive edge, creating new high-tech jobs and improving peoples’ lives.”

Josef Aschbacher, Director, Earth Observation, ESA, said, “The European Sentinel satellites are the largest providers of Earth observation data worldwide. A major challenge is to convert this fantastic data into customer-specific information. Large-scale hosted processing is the next step in order to meet this challenge, thereby bringing users to the data rather than data to the users.”

ESA will benefit from the in-memory computing power of the SAP HANA platform to make Earth observation data consumable both through the newly available Earth Observation Analysis service as well as in urban and environmental use cases or even beyond in the future.

The Earth Observation Analysis service can be tested at no cost in a nonproductive environment here from Nov. 8 until Dec. 31, 2016. The service is planned to be generally available in the first quarter of 2017. It will then be offered with a consumption-based pricing model that depends on the number of API calls. A set of related microservices, also powered by SAP HANA, will help entrepreneurs, partners, customers and businesses augment and build highly flexible solutions based on SAP HANA and Earth observation data from ESA in the future. SAP and ESA intend to continue their collaboration in developing solutions and technologies based on SAP technology that leverages geospatial information.

SAP today also unveiled SAP HANA 2, the next generation of the SAP HANA platform optimized for innovation. SAP HANA 2 includes and extends the proven technology from the SAP’s breakthrough in-memory computing platform to help organizations address the fast-changing requirements of digital business. As part of the product strategy of SAP HANA 2, the new SAP HANA microservices are intended to spur developer innovation by embedding richer insight into modern applications.

About the Center for Digital Leadership at SAP 
The Center for Digital Leadership organization at SAP is a leading source of insight into how to lead and drive digital transformation and innovation. Our network and partner ecosystem represents today’s and tomorrow’s leaders in digital business. Based on SAP’s digital internal transformation experiences, research and meetings with more than 200 CxO customers per year, we aim at being a digital thought leader for internal and external teams. We provide digitalization patterns and best practices to help our customers navigate through the digital transformation of their organization based on our holistic digital innovation and transformation framework, new methodologies and a thought leadership approach. For more information, check out www.sap.com/digitalleadership.

For more information, visit Center for Digital Leadership or the SAP News Center. Follow SAP on Twitter at @sapnews.

About SAP 
As market leader in enterprise application software, SAP (NYSE: SAP) helps companies of all sizes and industries run better. From back office to boardroom, warehouse to storefront, desktop to mobile device – SAP empowers people and organizations to work together more efficiently and use business insight more effectively to stay ahead of the competition. SAP applications and services enable more than 335,000 business and public sector customers to operate profitably, adapt continuously, and grow sustainably. For more information, visit www.sap.com.

Any statements contained in this document that are not historical facts are forward-looking statements as defined in the U.S. Private Securities Litigation Reform Act of 1995. Words such as “anticipate,” “believe,” “estimate,” “expect,” “forecast,” “intend,” “may,” “plan,” “project,” “predict,” “should” and “will” and similar expressions as they relate to SAP are intended to identify such forward-looking statements. SAP undertakes no obligation to publicly update or revise any forward-looking statements. All forward-looking statements are subject to various risks and uncertainties that could cause actual results to differ materially from expectations. The factors that could affect SAP’s future financial results are discussed more fully in SAP’s filings with the U.S. Securities and Exchange Commission (“SEC”), including SAP’s most recent Annual Report on Form 20-F filed with the SEC. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of their dates.

© 2016 SAP SE. All rights reserved. 
SAP and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP SE in Germany and other countries. Please see http://www.sap.com/corporate-en/legal/copyright/index.epx#trademark for additional trademark information and notices.

For customers interested in learning more about SAP products: 
Global Customer Center: +49 180 534-34-24 
United States Only: 1 (800) 872-1SAP (1-800-872-1727)

For more information, press only: 
Hilmar Schepp, +49 6227 7-46799, hilmar.schepp@sap.com, CET 
Cathrin von Osten, +49 6227 7-63908, cathrin.von.osten@sap.com, CET 
SAP News Center press room; press@sap.com

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QTS Declares $0.36 Fourth Quarter Common Stock Dividend

OVERLAND PARK, Kan., Nov. 7, 2016 /PRNewswire/ — QTS Realty Trust, Inc. (NYSE: QTS), one of the nation’s largest and fastest-growing providers of data center facilities and cloud services, announced today that its Board of Directors has authorized a cash dividend of $0.36 per share on its common stock for the fourth quarter of 2016. The $0.36 per share dividend is payable on January 5, 2017 to common stockholders of record at the close of business on December 16, 2016.

About QTS
QTS Realty Trust, Inc. (NYSE: QTS) is a leading provider of secure, compliant data center, hybrid cloud and managed services. QTS features the nation’s only fully integrated technology services platform providing flexible, scalable solutions for the federal government, financial services, healthcare and high tech industries. QTS owns, operates or manages more than 5 million square feet of data center space and supports more than 1,000 customers in North America, Europe and Asia Pacific. In addition, QTS’ Critical Facilities Management (CFM) provides increased efficiency and greater performance for third-party data center owners and operators. For more information, please visit www.qtsdatacenters.com, call toll-free 877.QTS.DATA or follow us on Twitter @DataCenters_QTS.

Investor Relations Contact:
Stephen Douglas

Media Contact:        
Sharon Goldmacher
communications 21

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SOURCE QTS Realty Trust, Inc.

OmniVision Introduces New Family of 16-Megapixel Sensors with Latest PureCel®Plus-S Technology for Mobile Devices

BEIJING, Nov. 7, 2016 /PRNewswire/ — OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV16885 product series: the OV16885 and OV16885-4C. Built on OmniVision’s second-generation, 1.0-micron PureCel®Plus-S pixel architecture, the power-efficient OV16885 sensor family offers high-resolution and high-sensitivity imaging capabilities for both world- and user-facing smartphone cameras.

“As smartphone cameras evolve and become the camera of choice for many use cases, we see users expecting higher image quality and functionality from their smartphones’ imaging systems,” said Badri Padmanabhan, product marketing manager at OmniVision. “The OV16885 sensor series showcases OmniVision’s ongoing commitment to meet market demands by incorporating advanced features in slim, power-efficient packages.”

The OV16885, designed for main cameras in mainstream smartphones, provides an attractive upgrade option for phones in the currently popular 13-megapixel category. With advanced features such as phase detection autofocus (PDAF) and zig-zag high dynamic range (zHDR), the OV16885 delivers professional-grade images that can significantly enhance the smartphone user’s experience. Modern digital cameras historically fall short of the human visual system’s ability to perceive a wide brightness range, and the OV16885’s zHDR technology helps narrow this gap more elegantly than traditional frame-based HDR techniques.

zHDR uses a long and a short exposure in a single frame to extend the dynamic range capabilities of the sensors. Long and short exposure lines are diagonally interlaced across the entire pixel array in a zig-zag pattern. This enables live preview and video recording in HDR mode and single-shot full-resolution HDR images in capture mode without shutter lag.

Additional zHDR benefits include:

The OV16885-4C combines the benefits of OmniVision’s second-generation, 1.0-micron PureCel Plus-S technology with an advanced 4-cell in-pixel binning function to greatly enhance sensitivity. The OV16885-4C pairs with smart resolution recovery software solutions to achieve a balance between resolution and sensitivity, which can significantly improve front-facing camera image quality even in challenging lighting environments. With these advanced capabilities, the OV16885-4C can serve as an ideal choice for “super selfie” cameras in high-end smartphone devices.

OmniVision’s second-generation 1.0-micron PureCel Plus-S technology brings enhancements to buried color filter array (BCFA) and deep trench isolation (DTI). As a result, images and video captured by the OV16885 and OV16885-4C exhibit superior color reproduction and improved signal-to-noise ratio (SNR) as compared to prior generations, especially in low-light conditions.

Product Specifications
The OV16885 captures:

The OV16885 and OV16885-4C sensors fit into industry-standard module form factors for slim mobile devices. Both sensors are currently available for sampling and are expected to enter mass production in the first quarter of 2017. 

About OmniVision
OmniVision Technologies is a leading developer of advanced digital imaging solutions. Its award-winning CMOS imaging technology enables superior image quality in many of today’s consumer and commercial applications, including mobile phones, notebooks, tablets and webcams, digital still and video cameras, security and surveillance, entertainment devices, automotive and medical imaging systems. Find out more at www.ovt.com.

OmniVision®, the OmniVision logo, and PureCel® are registered trademarks of OmniVision Technologies, Inc. All other trademarks are the property of their respective owners.

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SOURCE OmniVision Technologies, Inc.

Research and Markets – Global Fan-in Wafer Level Packaging Market CAGR Growth of 9.63% by 2020 – Trends, Technologies & Opportunities Report 2016-2020 – Vendors: Ultratech, SEMES, SUSS MicroTec

DUBLIN, November 7, 2016 /PRNewswire/ —

Research and Markets has announced the addition of the “Global Fan-in Wafer Level Packaging Market 2016-2020” report to their offering.

The global fan-in WLP market is forecast to grow at a CAGR of 9.63% during the period 2016-2020.

Commenting on the report, an analyst from the research team said: One trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period

According to the report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.

Further, the report states that rapid technological advances in wafer processing is a major challenge for vendors in the global fan-in WLP market. The transitions such as miniaturization of nodes and an increase in wafer sizes in ultra-large scale integration (ULSI) fabrication technology in the global semiconductor industry instigate semiconductor manufacturers to increase the development and adoption of new technologies, especially in packaging solutions.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Questions Answered:

Companies Mentioned:

Report Structure:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Technology landscape

PART 06: Market landscape

PART 07: Market segmentation by application

PART 08: Geographical segmentation

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

PART 15: Market summary

PART 16: Appendix

PART 17: About the Author

For more information about this report visit http://www.researchandmarkets.com/research/9s6j4q/global_fanin

Media Contact:

Research and Markets

Laura Wood, Senior Manager


For E.S.T Office Hours Call +1-917-300-0470

For U.S./CAN Toll Free Call +1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

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SOURCE Research and Markets

First Device in Family to Implement "Flexible Power Islands"

MUNICH, Nov. 7, 2016 /PRNewswire/ — Silego Technology announces the SLG46125, further expanding the GreenPAKTM (GPAK) family of Programmable Mixed-signal ICs. This newest GPAK can serve as an ultra-small power management IC which contains a rich set of features, including voltage monitoring, power sequencing, reset and power switches that are configurable in settings and interconnect.  This device is the first in a series of parts designed to create “Flexible Power Islands” (FPI).

Silego originally made this announcement at a press conference held in advance of electronica, “the World’s Leading Trade Fair for Electronic Components, Systems and Applications,” in Munich, Germany. At this conference, Silego made several other announcements that we believe reinforces Silego’s position as a market leader in Configurable Mixed-signal and Power solutions with advanced system protection features.

There are many challenges when designing power systems for handheld and wearable devices.  In each succeeding generation, power systems are becoming more complex, and yet the overall board area devoted to power components keeps getting smaller.  To overcome these challenges, Silego has developed the concept of “Flexible Power Islands”.  Using FPIs, designers can divide their complex power system into some number of local power regions (or islands), each of which includes the power control, power sequencing and power regulation needed to support loads in the immediate vicinity.  We believe this technique results in higher performance and a more efficient solution that can be flexibly tailored to the requirements of each individual system.

With the SLG46125, Silego has captured many of these necessary power system functions (power monitoring, sequencing, reset and power switching) in a tiny 1.6 x 2.0 mm 16-pin MSTQFN fully encapsulated plastic package. Using Silego’s easy-to-use GUI based GPAK Designer™ and GPAK development hardware, designers can quickly and easily implement their unique configuration of the device, thereby customizing the functions to match their unique power requirements.

“Flexible Power Islands are just what our customers have been asking for to address their challenges in developing power systems for ever-more complex mobile devices,” states Nathan John, Director of Marketing. “We want to give customers key functions of their power system in a tiny, low cost device.  Each of these devices can service the needs of loads in a local region of the printed circuit board.  We believe this advancement in architecture will result in big gains in efficiency, while at the same time driving down cost and board space. We believe this is yet another example of how Silego’s Configurable Mixed-signal IC (CMIC) strategy provides value to customers.”

Since the introduction of the CMIC platform, Silego has developed five generations of CMIC silicon and design tools. Each generation has added functionality and enhanced the design experience. As a result, over 1,300 designs incorporating CMICs by Silego customers have gone into production in almost every end market:

For pricing, samples, datasheets, and technical information about these devices and the GPAK Designer software, contact our customer service team at: info@silego.com or visit our website: http://www.silego.com.

About Silego – The CMIC Company

Silego Technology is a fabless semiconductor company creating Configurable Mixed-signal Integrated Circuits, or CMICs, which enable a paradigm shift in the way that hardware engineers design their systems. The Company’s CMICs integrate analog, digital logic, mixed-signal, and power functions while eliminating passive and discrete components. For more information, visit http://www.silego.com

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SOURCE Silego Technology

Silego's Latest Configurable Mixed-signal ICs Pack Plenty of Analog & Digital Functionality in Tiny Packages

MUNICH, Nov. 7, 2016 /PRNewswire/ — Silego Technology announces three new 14-pin and three new 22-pin 2.0 x 2.2 mm GreenPAKTM Programmable Mixed-signal Matrix ICs, further expanding Silego’s industry leading platform of Configurable Mixed-signal ICs (CMICs).

Silego originally made this announcement at a press conference held in advance of electronica, “the World’s Leading Trade Fair for Electronic Components, Systems and Applications,” in Munich, Germany. At this conference, Silego made several other announcements that we believe further reinforces Silego’s position as a market leader in Configurable Mixed-signal and Power solutions with advanced system protection features.

The six new, feature-rich CMIC devices are designed to implement many system functions, such as system reset, power sequencing, voltage monitoring, and more, with minimal space and power overhead. The devices have been designed to make adding new features to highly integrated systems relatively easy with integrated, programmable analog and digital components, such as look-up tables, D-flip flops, counters, delays, analog comparators, and more.

Also included in these devices are the Asynchronous State Machine and I2C blocks. These two features add more flexibility, functionality, and ease of design to the GreenPAK family of devices. With the addition of the Asynchronous State Machine, designers can implement up to 8 unique states with zero code, zero static power, and fail-safe operation. GreenPAK I2C enables designers to change device configuration, such as analog comparator thresholds, quickly, and allows designers to act as a GPIO expander, writing digital signals to component inputs.

Like other devices in the GreenPAK family, creating custom mixed-signal projects is made simple using the GreenPAK development hardware and simple GUI interface of GreenPAK Designer, allowing engineers to quickly and easily implement new designs and respond to changing design requirements. Additionally, with these devices, designers can now perform on-board emulation and in-system debug, using I2C.

“These six new devices allow us to offer even more value in a smaller area,” states Sean Carty, Sr. Product Marketing Engineer. “We believe the amount of flexibility and features these devices provide in just 4.4 mm2 is phenomenal. Silego continues to add new and exciting products, bringing more solutions to our customers to facilitate differentiation in their products using minimal additional board space and power.”

Since the introduction of the CMIC platform, Silego has developed five generations of CMIC silicon and design tools. Each generation has added functionality and enhanced the design experience. As a result, over 1,300 designs incorporating CMICs by Silego customers have gone into production in almost every end market:

The new part numbers are the 14-pin SLG46534V, SLG46535V, and SLG46536V as well as the 22-pin SLG46533M, SLG46537M, and SLG46538M.

For pricing, samples, datasheets, and technical information about these devices and the GPAK Designer software, contact our customer service team at: info@silego.com or visit our website: http://www.silego.com.

About Silego – The CMIC Company

Silego Technology is a fabless semiconductor company creating Configurable Mixed-signal Integrated Circuits, or CMICs, which enable a paradigm shift in the way that hardware engineers design their systems. The Company’s CMICs integrate analog, digital logic, mixed-signal, and power functions while eliminating passive and discrete components. For more information, visit http://www.silego.com.  

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SOURCE Silego Technology

Xilinx Demonstrates Reconfigurable Acceleration for Cloud Scale Applications at SC16

SAN JOSE, Calif., Nov. 7, 2016 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will demonstrate reconfigurable acceleration for cloud scale applications at SC16. Through a series of demonstrations and presentations, Xilinx and its ecosystem will highlight how Xilinx® All Programmable technologies are ideally suited to handle computationally intensive data center workloads including machine learning, data analytics, video transcoding, storage and networking – enabling the world’s largest cloud service providers to develop and deploy reconfigurable acceleration platforms at cloud scale. To learn more, visit Xilinx at booth #3640, November 14 – 17, 2016 at the Salt Palace Convention Center, Salt Lake City, UT.

Logo – http://photos.prnewswire.com/prnh/20020822/XLNXLOGO

Conference Participation
Monday, November 14

Tuesday, November 15

Xilinx Technology Briefing — Reconfigurable Acceleration in the Cloud Data Center
Wednesday, November 16 at 9:00AM
Location: Utah Museum of Contemporary Art (UMOCA)
In this briefing, the principals from Xilinx engineering and research will outline how cloud scale data centers can take advantage of a flexible, power efficient FPGA accelerator platform and provide a look at the Xilinx technology roadmap ahead. Register Now.

Xilinx Demonstrations and Developer Zone – Booth #3640

Acceleration Developer Zone
The Acceleration Developer Zone is a hands-on opportunity to learn about the evolution of FPGA programming models towards standard programming paradigms like OpenCL. Workstations will be available with a choice of four self-paced tutorials in English and Mandarin and Xilinx experts will be on hand for one-on-one instruction. Participants will get a complimentary trial to the Xilinx developer cloud resources hosted by Nimbix, a leading provider of heterogeneous accelerator clouds for big data and machine learning.

Learn more about these in-booth demos at

Xilinx Ecosystem Demonstrations throughout the Show Floor

About Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, Embedded Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.


© Copyright 2016 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.

Silvia E. Gianelli
(408) 626-4328


SOURCE Xilinx, Inc.

Widely Used Investing Social Platform StockTwits Launches MoneyBadger.com Site for Newer Investors

NEW YORK, Nov. 7, 2016 /PRNewswire/ — StockTwits Inc, the largest social platform for investors and traders, launched MoneyBadger.com today, a new content site created for new and casual investors. StockTwits is well known in the retail investing and trading communities as the definitive social platform for discussing intraday market activity, with more than 200 messages posted each minute across 7,500 individual stocks and tickers.

“Every day, our social streams are full of fascinating stories of companies and stocks as told by market participants, but those stories aren’t necessarily accessible or useful in their current form to the average person,” said StockTwits CEO Ian Rosen. “Many financial news sites provide information on markets or investing, but Money Badger is the first to bring the incredibly interesting world of the trading floor, seen through the eyes of traders rather than media, to the public- and to relate that world to people’s own daily lives and goals.”

Money Badger will relate intraday market stories, provide basic investing education, and bring the stories that live in the daily StockTwits streams to life for the occasional investor or those new to trading.

“Whether it’s a crazy ride for a company whose mobile phones have a newly discovered habit of exploding, or the basics of how a bond works-  as a publication, Money Badger’s purpose is to help those who’ve never invested to learn the basics of the market, to buy their first shares of stock, and to become engaged with the fascinating market stories that evolve each day,” said Scott Steinhardt, Editor. “We make business news easily digestible and relatable, with an added touch of savvy and humor.”

Money Badger content is available at moneybadger.com, on Facebook at facebook.com/gomoneybadger, and on Twitter at @gomoneybadger.

About StockTwits

StockTwits, founded in 2008, is the largest social platform for investors and traders, and also the host of events such as Stocktoberfest held annually in Coronado, CA, and more than 150 other events annually in 37 cities.

SOURCE StockTwits